Microchip Fabrication: A Practical Guide to Semiconductor Processing by Peter Van Zant
If you are looking for a comprehensive and accessible introduction to the semiconductor industry, you might want to check out Microchip Fabrication: A Practical Guide to Semiconductor Processing by Peter Van Zant. This book is the fifth edition of a popular text that has been used for training, teaching, and vocational-technical programs for more than 15 years.
Microchip Fabrication covers every stage of semiconductor processing, from raw material preparation to packaging and testing. It explains the basic concepts and techniques of solid-state, planar processing, and doping of N-type and P-type semiconducting materials. It also describes the latest advances in nanotechnology, 300-mm wafer processing, \"green\" processes and devices, and new fabrication methods.
The book uses a straightforward, math-free approach that is suitable for beginners and experts alike. It includes many detailed illustrations and analogies to everyday life that make the complex topics easy to understand. It also features challenging quizzes and review summaries at the end of each chapter, as well as an extensive glossary of terms.
Whether you are a student, a technician, an engineer, or a manager in the semiconductor industry, you will find Microchip Fabrication a valuable and informative resource. You can access the book online via AccessEngineering or purchase a hard copy from McGraw-Hill or other online retailers.
Some of the topics that the book covers in detail are: oxidation, lithography, doping, deposition, etching, metallization, packaging, and testing. These are the essential processes that enable the creation of microchips with millions or billions of transistors on a tiny piece of silicon. The book also explains the principles and applications of various types of semiconductor devices, such as diodes, transistors, LEDs, lasers, solar cells, memory chips, and integrated circuits.
One of the challenges that the semiconductor industry faces is to keep up with the increasing demand for faster, smaller, cheaper, and more energy-efficient devices. This requires constant innovation and improvement in materials, processes, and designs. The book discusses some of the emerging trends and technologies that are shaping the future of semiconductor processing, such as nanotechnology, 300-mm wafer processing, \"green\" processes and devices, and new fabrication methods.
Nanotechnology refers to the manipulation of matter at the atomic or molecular scale. It has many potential applications in various fields, including electronics. For example, nanowires, nanotubes, nanodots, and quantum dots are some of the nanostructures that can be used to create novel semiconductor devices with enhanced properties and functions. Nanotechnology can also enable new ways of integrating different materials and devices on a single chip.
300-mm wafer processing refers to the use of silicon wafers with a diameter of 300 millimeters (about 12 inches) for semiconductor fabrication. This is the largest size of wafers that are currently used in the industry, and it offers several advantages over smaller wafers, such as lower cost per chip, higher productivity, and better yield. 300-mm wafer processing also enables the integration of more complex and advanced devices on a single chip.
However, 300-mm wafer processing also poses some challenges and requires special equipment and facilities. For example, the larger size of the wafers means that they are heavier and more fragile, and they need more precise handling and alignment. The increased complexity and density of the devices also demand higher quality and uniformity of the materials and processes. Moreover, 300-mm wafer processing requires more stringent environmental and safety standards, as well as higher investments in infrastructure and research.
Despite these challenges, 300-mm wafer processing has become the dominant standard for high-volume production of semiconductor devices, especially for logic and memory chips. According to a report by SEMI, a global industry association for the electronics manufacturing supply chain, 300-mm wafers accounted for about 70% of the total silicon wafer area shipped in 2020. The report also projected that 300-mm wafers will continue to grow in market share and reach about 80% by 2024. 29c81ba772